The manufacture method of opening contact hole on multi-layer insulation film

The manufacture method of opening contact hole on multi-layer insulation film

  • CN 106,098,614 A
  • Filed: 08/16/2016
  • Published: 11/09/2016
  • Est. Priority Date: 08/16/2016
  • Status: Active Application
First Claim
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1. the manufacture method of an opening contact hole on multilayer insulating film, it is characterised in that comprise the steps:

  • At wire (10) upper formation the first insulation film (21), described wire (10) is made of an electrically conducting material;

    In described first insulation film (21), the first contact hole (TH11), described first contact hole is formed by etch process(TH11) described first insulation film (21) is run through, to expose described wire (10);

    Described first insulation film (21) upper formation the second insulation film (22), described second insulation film (22) is inserted describedIn first contact hole (TH11);

    In described second insulation film (22), the second contact hole (TH12), described second contact hole is formed by etch process(TH12) described second insulation film (22) is run through, to expose described wire (10), wherein said second contact hole (TH12)It is smaller in size than described first contact hole (TH11) so that be etched forming described second to described second insulation film (22)Described first insulation film (21) will not be etched into during contact hole (TH12);

    AndForming conductive tie layers (23) on described second insulation film (22), described conductive tie layers (23) inserts described secondConducting is contacted in contact hole (TH12) and with described wire (10).

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