Ultrasonic electronic gas meter

Ultrasonic electronic gas meter

  • CN 106,197,582 B
  • Filed: 07/28/2016
  • Issued: 12/15/2020
  • Est. Priority Date: 07/28/2016
  • Status: Active Grant
First Claim
Patent Images

1. An ultrasonic electronic gas meter, comprising:

  • the ultrasonic probe and the digital-to-analog conversion module are connected;

    the digital-to-analog conversion module converts data obtained by the ultrasonic probe into a digital signal;

    pressure sensors, temperature sensors;

    metering an MCU;

    the metering MCU receives and processes data transmitted to the metering MCU by the digital-to-analog conversion module, the pressure sensor and the temperature sensor;

    managing the MCU;

    communicating with a serial port of the metering MCU and exchanging data;

    an IC card management module;

    the management MCU is connected with the management MCU and exchanges data with the management MCU;

    a motor valve;

    the management MCU is connected with the management MCU and used for receiving the signal of the management MCU to be turned on or turned off;

    a power supply module;

    the power module includes;

    the system comprises an ultrasonic power supply voltage stabilizing circuit, a management MCU power supply voltage stabilizing circuit and a GPRS module power supply voltage stabilizing circuit;

    ultrasonic wave power supply voltage stabilizing circuit, management MCU power voltage stabilizing circuit, GPRS module power voltage stabilizing circuit include;

    one end of the power supply battery is connected to the anode of the eighth diode, the cathode of the eighth diode is respectively connected to the anode of the sixteenth capacitor and the input end of the second HS7333 chip, the grounding end of the second HS7333 chip is grounded, and the output end of the second HS7333 chip is connected with the power supply input end of the ultrasonic probe;

    the cathode of the sixteenth capacitor is grounded;

    the anode of the seventh diode is connected with one end of the power supply battery, the cathode of the seventh diode is connected with the input end of the first HS7333 chip, the grounding end of the first HS7333 chip is grounded, the output end of the first HS7333 chip is connected with the anode of the fifth diode and the anode of the seventeenth capacitor, the cathode of the fifth diode is connected with the cathode of the ninth diode, the anode of the ninth diode is connected with one end of the power supply battery, and the cathode of the seventeenth capacitor is grounded;

    one end of the fourteenth resistor is connected to the negative electrode of the ninth diode, and the other end of the fourteenth resistor is grounded;

    the power supply end of the signal receiving board is connected to the cathode of the ninth diode, the output end of the signal receiving board is connected to the power supply input end of the management MCU after being connected to the eleventh resistor, and the grounding end of the signal receiving board is connected to the anode of the sixth diode;

    one end of the twenty-fifth resistor is connected to the negative electrode of the seventh diode, the other end of the twenty-fifth resistor is connected to the collector of the NPN type triode, the base of the NPN type triode is connected with the on-off signal input end after being connected in series with the twenty-eighth resistor, and the emitter of the NPN type triode is grounded;

    the base electrode and the emitting electrode of the NPN type triode are respectively connected to the two ends of the eighteenth resistor;

    the grid electrode of the MOS tube is connected with the collector electrode of the NPN type triode, the source electrode of the MOS tube is connected with the cathode of the seventh diode, and the drain electrode of the MOS tube is connected with the first pin of the LM25765S chip;

    the third pin and the fifth pin of the LM25765S chip are grounded, after the first resistor, the first capacitor and the first diode are connected in parallel, one end of the first resistor is connected to the first pin of the LM25765S chip, and the other end of the first resistor is connected to the third pin of the LM25765S chip;

    the anode of the second diode is grounded, the cathode of the second diode is connected into a second pin of the LM25765S chip, one end of the first inductor is connected into a second pin of the LM25765S chip, the other end of the first inductor is connected into the anode of the second capacitor, the cathode of the second capacitor is grounded, one end of the second resistor is connected into the anode of the second capacitor, the other end of the second resistor is connected with a third resistor in series and then is grounded, and the fourth pin of the LM25765S chip is connected between the second resistor and the third resistor;

    after the ninth capacitor and the eleventh capacitor are connected in parallel, one end of the ninth capacitor is connected to the positive electrode of the second capacitor, and the other end of the ninth capacitor is grounded;

    the metering MCU is an E703.15 chip;

    after the forty-ninth capacitor and the forty-eighth capacitor are connected in parallel, one end of the forty-ninth capacitor is connected to the first pin of the E703.15 chip, and the other end of the forty-ninth capacitor is grounded;

    a seventh pin and an eighth pin of the E703.15 chip are respectively connected with a sixth pin and a fifth pin of the 24C02 chip;

    one end of a thirty-fourth resistor is connected to a first pin of an E703.15 chip, the other end of the thirty-fourth resistor is connected to a seventh pin of an E703.15 chip, one end of a thirty-fifth resistor is connected to a first pin of an E703.15 chip, and the other end of the thirty-fifth resistor is connected to an eighth pin of the E703.15 chip;

    a thirty-sixth resistor, a thirty-seventh resistor, a thirty-ninth resistor, a forty-th resistor, a thirty-eighth resistor, a temperature sensor, a forty-second resistor and a twenty-ninth capacitor are sequentially connected in series, and then the two sections are grounded;

    a fifteenth pin of the E703.15 chip is connected between a thirty-sixth resistor and a thirty-seventh resistor;

    a sixteenth pin of the E703.15 chip is connected between a thirty-seventh resistor and a thirty-ninth resistor;

    a seventeenth pin of the E703.15 chip is connected between a thirty ninth resistor and a forty fourth resistor;

    an eighteenth pin of the E703.15 chip is connected between a fortieth resistor and a thirty-eighth resistor;

    a nineteenth pin of the E703.15 chip is connected between a thirty-eighth resistor and a forty-first resistor;

    the twentieth pin of the E703.15 chip is connected between the forty-first resistor and the temperature sensor;

    a twenty-first pin of the E703.15 chip is connected between the temperature sensor and a forty-second resistor;

    a twenty-second pin of the E703.15 chip is connected between a forty-second resistor and a twenty-ninth capacitor;

    after the fifty-th capacitor and the twenty-ninth capacitor are connected in parallel, one end of the fifty-th capacitor is connected to the twenty-fourth pin of the E703.15 chip, and the other end of the fifty-fifth capacitor is grounded;

    the twenty-fifth pin and the twenty-sixth pin of the E703.15 chip, the twenty-fifth pin and the twenty-seventh pin, and capacitors are connected in series between the twenty-sixth pin and the twenty-eighth pin;

    the positive input end of a first AD8309 amplifier is connected to the twenty-fifth pin of the E703.15 chip, the negative input end of the first AD8309 amplifier is connected with the output end of the first AD8309 amplifier, the output end of the first AD8309 amplifier is connected to the negative input end of a second AD8309 amplifier after being connected with a first resistor, and the output end of the second AD8309 amplifier is connected to one end of an ultrasonic testing interface;

    the positive input end of a third AD8309 amplifier is connected to twenty-sixth pin of the E703.15 chip, the negative input end of the third AD8309 amplifier is connected to the output end of the third AD8309 amplifier, and the output end of the third AD8309 amplifier is connected to a second resistor and then is respectively connected to the positive input end of the second AD8309 chip and the other end of the ultrasonic testing interface;

    the thirty-two and thirty-three pins of the E703.15 chip are connected with the first ultrasonic probe;

    the thirty-fifth pin and the thirty-sixth pin of the E703.15 chip are connected to the second ultrasonic probe.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×