The heat abstractor of power device and the cooling control method of power device

The heat abstractor of power device and the cooling control method of power device

  • CN 106,211,703 A
  • Filed: 04/30/2015
  • Published: 12/07/2016
  • Est. Priority Date: 04/30/2015
  • Status: Active Application
First Claim
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1. the heat abstractor of a power device, it is characterised in that including:

  • Semiconductor chilling plate, the huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate contacts with each other with described power device;

    Fin, described fin contacts with each other with the hot side of described semiconductor chilling plate;

    Radiator fan, described radiator fan is for carrying out wind-cooling heat dissipating to described semiconductor chilling plate and described fin;

    Drive circuit, described drive circuit is connected with described semiconductor chilling plate and described radiator fan respectively;

    AndPanel, described panel is connected with described drive circuit, and described panel is used for by described drive circuit describedSemiconductor chilling plate and described radiator fan are controlled.

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