Semiconductor device and manufacture method thereof including the redistributing layer thickeied

Semiconductor device and manufacture method thereof including the redistributing layer thickeied

  • CN 106,233,460 A
  • Filed: 03/09/2015
  • Published: 12/14/2016
  • Est. Priority Date: 03/10/2014
  • Status: Active Application
First Claim
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1. the method manufacturing semiconductor packages, including:

  • Forming multiple thick redistributing layer (RDL) trace above the active surface of multiple semiconductor elements, the plurality of thickness is divided againLayer of cloth trace is electrically connected to the contact pad on the plurality of semiconductor element;

    Segmentation includes the plurality of semiconductor element of the plurality of thick redistributing layer trace;

    The plurality of semiconductor element of segmentation is arranged on the top of temporary carrier, the institute of wherein said multiple semiconductor elementsState active surface and deviate from described temporary carrier orientation;

    The described active surface of each sealant material being arranged in the plurality of semiconductor element and at least four sideAbove surface, the plurality of thick redistributing layer trace and above described temporary carrier;

    Form the through hole through described sealant material, to expose the redistribution of the multiple thickenings relative to described sealant materialAt least one trace in layer trace;

    Remove described temporary carrier;

    AndSplit the plurality of semiconductor element.

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