Electronic building brick and manufacture method

Electronic building brick and manufacture method

  • CN 106,298,711 A
  • Filed: 11/05/2015
  • Published: 01/04/2017
  • Est. Priority Date: 06/26/2015
  • Status: Active Application
First Claim
Patent Images

1. an electronic building brick, for an electronic product, it is characterised in that described electronic building brick includes:

  • One substrate;

    One projection, arranges over the substrate, is for electrically connecting to described electronic product;

    AndAt least one projection bottom metal layer, is arranged between described projection and described substrate and allows described projection pasteClose described substrate;

    Wherein, described projection bottom metal layer forms a gap structure, is used for improving described projection with describedShearing stress ability between substrate, couples relation with firm described projection and described substrate.

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