The radiator structure of a kind of pcb board and the manufacture method of this radiator structure

The radiator structure of a kind of pcb board and the manufacture method of this radiator structure

  • CN 106,304,616 A
  • Filed: 08/19/2016
  • Published: 01/04/2017
  • Est. Priority Date: 08/19/2016
  • Status: Active Application
First Claim
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1. the radiator structure of a pcb board, it is characterised in that described pcb board includes ground floor, the second layer and is arranged at describedThe first intermediate layer between ground floor and the second layer, described radiator structure includes heat dissipation bonding pad, dissipating vias and gong slotted eye;

  • Described heat dissipation bonding pad is arranged at described ground floor, and is positioned at described ground floor and deviates from a surface in described first intermediate layer;

    Described dissipating vias runs through described heat dissipation bonding pad, ground floor and the first intermediate layer, is filled with and has in described dissipating viasThe first medium of heat conduction function;

    Described gong slotted eye runs through the described second layer and extends to described first intermediate layer, and described gong slotted eye is with described dissipating vias evenLogical, it is filled with the second medium with heat conduction function in described gong slotted eye, described second medium contacts with described first medium.

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