Metal Top Stacking Package Structure and Method for Manufacturing the same

Metal Top Stacking Package Structure and Method for Manufacturing the same

  • CN 106,409,779 A
  • Filed: 03/18/2016
  • Published: 02/15/2017
  • Est. Priority Date: 04/03/2015
  • Status: Active Grant
First Claim
Patent Images

1. a kind of top metal stack package structure, including:

  • One metallic substrates, comprise a upper surface and a lower surface, and a chip receives chamber and is formed on this upper surface;

    One first chip, receives chamber by one first binder courses to be fixed on this chip;

    One substrate, has a upper surface;

    One second chip, by one second binder courses to be fixed on this upper surface of this substrate;

    AndMultiple connecting elements, are formed at this upper surface of this substrate;

    Wherein, by those connecting elements by this upper surface of this metallic substrates and this substrate connection.

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