Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method

Copper-aluminum compound water-cooling plate and processing and manufacturing method thereof as well as water-cooling heat dissipation method

  • CN 106,455,456 A
  • Filed: 12/06/2016
  • Published: 02/22/2017
  • Est. Priority Date: 12/06/2016
  • Status: Active Application
First Claim
Patent Images

1. a kind of Copper-Aluminum compound cooled plate, including substrate and the cover plate being connected to substrate back, described substrate is provided with coolingLiquor stream road, is characterized in that, described substrate adopts copper-aluminum composite board structure, and substrate includes copper coin and the aluminum pressing together with copper coinPlate, substrate front side is the copper coin for installing module device, and substrate back is aluminium sheet, and cooling liquid flowing channel is arranged on aluminium sheet part;

  • It is provided with Fructus Jujubae nutty structure inside described cooling liquid flowing channel:

    Cooling liquid flowing channel inner surface setting has some Semen Jujubae shape projections, Semen Jujubae shapeProjection is in the cooling liquid flowing channel being arranged in substrate back by the way of distribution side by side plus series arrangement combine.

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