Package for a differential pressure sensing die

Package for a differential pressure sensing die

  • CN 106,461,482 A
  • Filed: 02/27/2015
  • Published: 02/22/2017
  • Est. Priority Date: 02/28/2014
  • Status: Active Application
First Claim
Patent Images

1. one kind is used for receiving the encapsulation (800) that pressure reduction senses pedestal (300), and described pressure reduction sensing pedestal includes quasiconductor pedestal(310), described semiconductor-based seat tool has the film (313) of integral type, and it is suitable for measuring the pressure of the opposition side being applied to described filmDifference, described encapsulation includes:

  • First housing member (803), is configured to receive described pressure reduction sensing pedestal (300);

    At least one second housing member (801), described first housing member (803) and at least one second housing member described(801) it is configured to be fitted to each other to limit housing, described housing has and is defined in inner space therein, described for accommodatingPressure reduction sensing pedestal (300);

    First port (812), is defined through the wall of described first housing member (803), when described pressure reduction sensing pedestal is heldWhen being contained in described first housing member (803), described first port is orientated as and is limited to described pressure reduction sensing pedestal (300)The first side in hole (307) fluid flow communication sealing;

    AndSecond port (810), is defined through the wall of described second housing member (801), when described first housing member (803)When coordinating with described second housing member (801), described second port (810) is orientated as and is limited to described pressure reduction sensing pedestal(300) the second hole (309) the fluid flow communication sealing in the second side contrary with described first side.

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