Organic silicon resin aluminum-based copper-clad plate and preparation method thereof

Organic silicon resin aluminum-based copper-clad plate and preparation method thereof

  • CN 106,467,668 B
  • Filed: 08/19/2015
  • Issued: 07/30/2021
  • Est. Priority Date: 08/19/2015
  • Status: Active Grant
First Claim
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1. The organic silicon resin aluminum-based copper-clad plate comprises a copper foil layer, an insulating layer and an aluminum plate layer which are sequentially arranged, wherein the insulating layer is prepared from an organic silicon resin composition, and the organic silicon resin composition comprises the following components in parts by weight, a cross-linking agent, a heat-conducting filler accounting for 20-45% of the organic silicon resin composition by volume and a white filler accounting for 0-30% of the organic silicon resin composition by mass:

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