Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

Microelectromechanical sensor device with reduced stress-sensitivity and corresponding manufacturing process

  • CN 106,517,079 A
  • Filed: 03/30/2016
  • Published: 03/22/2017
  • Est. Priority Date: 09/11/2015
  • Status: Active Application
First Claim
Patent Images

1. a kind of MEMS (20), including:

  • Support base (22), with the basal surface (22b) for being designed to contact with external environment condition;

    Sensor die (24), including semi-conducting material and integrated micro-mechanical detection structure(25);

    Sensor frame (30), is arranged in around the sensor die (24) and mechanicallyIt is coupled to the top surface (22a) of the support base (22);

    AndCap (36), is arranged in above the sensor die (24) and is mechanically coupled toThe top surface (30a) of sensor frame (30), the corresponding top surface of cap (36)(36a) it is designed to contact with the external environment condition,It is characterized in that sensor die (24) are mechanical from sensor frame (30)Ground uncoupling.

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