Solder resist composition, and coated printed wiring board

Solder resist composition, and coated printed wiring board

  • CN 106,537,253 A
  • Filed: 02/09/2016
  • Published: 03/22/2017
  • Est. Priority Date: 02/10/2015
  • Status: Active Application
First Claim
Patent Images

1. a kind of solder mask composition, containing containing carboxy resin (A), containing selected from photopolymerization monomer and photopolymerizing prepolymersIn at least one photopolymerizable compound (B), Photoepolymerizationinitiater initiater (C), thermosetting component (D), be black colorant(E1) a kind of coloring agent (E2), and beyond black;

  • With following property:

    Make the solder mask composition carry out heat cure after photocuring on copper coin, become 18~

    22 μ

    m of modelsThe L of the envelope of the solder mask composition of the arbitrary thickness in enclosing*It is worth for less than 40, a*It is worth in the range of 5.1~

    55, b*It is worth in the range of -15~

    15.

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