Thermally-conductive electromagnetic interference (EMI) absorbers

Thermally-conductive electromagnetic interference (EMI) absorbers

  • CN 106,604,606 A
  • Filed: 10/17/2016
  • Published: 04/26/2017
  • Est. Priority Date: 10/16/2015
  • Status: Active Grant
First Claim
Patent Images

1. a kind of component, the component include:

  • Board-level shield, the board-level shield include opening;

    Heat conduction electromagnetic interference EMI absorber, heat conduction EMI absorbers are arranged to make to pass in the heat conduction EMI absorbersThe EMI decay broadcast;

    AndStructure, the structure are positioned relative to the board-level shield and the heat conduction EMI absorbers so that opened by describedMouthful EMI is by the structure barrier and redirects, between the board-level shield and the structure the heat conduction EMI inhaleReceive and propagated in device.

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