SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

  • CN 106,611,713 A
  • Filed: 02/25/2016
  • Published: 05/03/2017
  • Est. Priority Date: 10/27/2015
  • Status: Active Application
First Claim
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1. a kind of preparation method of semiconductor package body, it is characterised in that the preparation method of the semiconductor package body is included:

  • Multiple semiconductor wafers are set above the upper surface of wafer;

    With the plurality of semiconductor wafer of the first cast material cast;

    AndAfter the plurality of semiconductor wafer of cast, in the top of the plurality of semiconductor wafer composite bed is formed.

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