Semiconductor package and manufacturing method thereof

Semiconductor package and manufacturing method thereof

  • CN 106,611,713 B
  • Filed: 02/25/2016
  • Issued: 09/03/2021
  • Est. Priority Date: 10/27/2015
  • Status: Active Grant
First Claim
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1. A method of fabricating a semiconductor package, the method comprising:

  • arranging a plurality of semiconductor chips above the wafer;

    molding the plurality of semiconductor wafers with a first molding material; and

    after casting the plurality of semiconductor wafers, forming a composite material over the plurality of semiconductor wafers, the forming a composite material comprising;

    disposing an intermediate metal material over the semiconductor wafer; and

    disposing a second cast material on the intermediate metallic material, wherein the first cast material is similar in material to the second cast material;

    grinding the wafer on a side of the wafer opposite the composite material to thin the wafer; and

    supporting the semiconductor package with the composite material during the grinding of the wafer.

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