Convex point structure for surrounding sealing ring and formation method for convex point structure

Convex point structure for surrounding sealing ring and formation method for convex point structure

  • CN 106,653,721 A
  • Filed: 11/25/2016
  • Published: 05/10/2017
  • Est. Priority Date: 11/25/2016
  • Status: Active Application
First Claim
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1. a kind of bump structure around sealing ring, it is characterised in that:

  • Including a chip, the chip have first surface and withIts relative second surface, the first surface has an at least electrode zone, and the first surface or the second surface setThere is at least one of which metal level, the metal level is provided with one layer of welding resisting layer, offer on the welding resisting layer and expose the metal levelConductive welding disk, is disposed with polymer adhesive and salient point, anti-welding after the polymer adhesive backflow on the conductive welding diskThe sealing ring in the parcel salient point foundation portion is formed on layer.

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