Copper-tin alloy plating bath

Copper-tin alloy plating bath

  • CN 106,661,752 B
  • Filed: 07/28/2015
  • Issued: 08/10/2021
  • Est. Priority Date: 08/08/2014
  • Status: Active Grant
First Claim
Patent Images

1. A copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble 2-valent tin compound, a sulfur-containing compound represented by the general formula (1), an aromatic compound having a hydroxyl group, a nonionic surfactant, and an aromatic ketone or aromatic aldehyde,R-

  • (CH2)1

    S-

    (CH2)m

    S-

    (CH2)n

    R (1)wherein R is H, OH or SO3Na, l, m and n are each independently an integer of 0 to 3,the nonionic surfactant is at least 1 selected from the group consisting of polyoxyethylene alkylamine, polyoxyalkylene phenyl ether and polyoxyalkylene naphthyl ether,the aromatic ketone or aromatic aldehyde is at least 1 selected from the group consisting of benzalacetone, cinnamaldehyde, alpha-methylcinnamaldehyde, alpha-hexylcinnamaldehyde, alpha-pentylcinnamaldehyde, p-isopropylbenzaldehyde, benzaldehyde, and anisaldehyde,the mixing proportion of the water-soluble copper compound and the water-soluble 2-valent tin compound is as follows by the molar ratio of metal components;

    1, tin;

    0.1 to 0.3 of a surfactant,the copper-tin alloy plating bath contains 0.1 to 40g/L of the surfactant and 0.01 to 10g/L of the aromatic ketone or aromatic aldehyde, and the surfactant;

    the ratio of the aromatic ketone or aromatic aldehyde is 1;

    1-100;

    1.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×