High quality factor filter implemented in wafer level packaging (wlp) integrated device

High quality factor filter implemented in wafer level packaging (wlp) integrated device

  • CN 106,663,671 A
  • Filed: 07/01/2015
  • Published: 05/10/2017
  • Est. Priority Date: 07/03/2014
  • Status: Active Application
First Claim
Patent Images

1. a kind of integrated device, including:

  • Capacitor;

    AndBe electrically coupled to the inductor of the capacitor, wherein the inductor and the capacitor be configured to operate as it is described integratedOperate for the wave filter of electric signal in device, the inductor includes:

    The first metal layer of printed circuit board (PCB) (PCB);

    Coupled to one group of soldered ball of the PCB;

    AndSecond metal layer in tube core.

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