Heat dissipation structure, electronic equipment and assembling method thereof

Heat dissipation structure, electronic equipment and assembling method thereof

  • CN 106,686,954 B
  • Filed: 02/10/2017
  • Issued: 09/25/2020
  • Est. Priority Date: 02/10/2017
  • Status: Active Grant
First Claim
Patent Images

1. A heat dissipation structure, comprising:

  • the flexible metal pipe is used for filling heat dissipation liquid, at least one surface of the flexible metal pipe is in contact with the heat-generating component, and the flexible metal pipe can deform according to the hydraulic pressure of the heat dissipation liquid so as to be attached to the outer surface of the heat-generating component;

    the number of the flexible metal tubes is N, and N is an integer not less than 2;

    the nth flexible metal pipe can deform according to the hydraulic pressure of the heat dissipation liquid to be attached to the nth-1 and nth heat generating components;

    n is an integer not less than 2 and less than N;

    the metal radiator is connected with the flexible metal pipe and used for transferring heat absorbed by the radiating liquid;

    the flexible metal pipe is provided with a liquid hole and a packaging assembly for sealing the liquid hole, and the liquid hole can be used for filling and leading out the heat dissipation liquid;

    the packaging assembly is used for packaging the heat dissipation liquid after the heat dissipation liquid is filled.

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