Lead-free solder alloy for use in terminal preplating, and electronic component

Lead-free solder alloy for use in terminal preplating, and electronic component

  • CN 106,687,250 A
  • Filed: 09/04/2015
  • Published: 05/17/2017
  • Est. Priority Date: 09/04/2014
  • Status: Active Application
First Claim
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1. a kind of terminal pre-plating Lead-free solder alloy, it is characterised in that for implementing pre-plating to terminal by dipping,Cu is that more than 4 mass % and below 6 mass %, Ni is that more than 0.1 mass % and below 0.2 mass %, Ga is 0.01 matterBelow amount more than % and 0.04 mass %, P is that more than 0.004 mass % and below 0.03 mass %, the summation of Ga and P is 0.05Below quality %, surplus is made up of Sn,It is below 200dyn/cm by the tension force under molten condition obtained from the heating under soldering temperature.

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