Bonding device with integrated temperature sensing in bonding layer

Bonding device with integrated temperature sensing in bonding layer

  • CN 106,688,087 B
  • Filed: 07/07/2015
  • Issued: 07/23/2021
  • Est. Priority Date: 07/08/2014
  • Status: Active Grant
First Claim
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1. A heating device, comprising:

  • a first member;

    a second member disposed adjacent to the first member, the second member being a heating plate comprising at least one heating element for heating the first member;

    an adhesive layer disposed between the first member and the second member, the adhesive layer securing the second member to the first member and containing a phosphorescent material; and

    ;

    at least one optical sensor disposed adjacent to the bonding layer to detect a temperature of the bonding layer in a field of view of the optical sensor,wherein the phosphorescent material is embedded in the binding layer such that the binding layer and the phosphorescent material together form a single layer to provide dual functionality;

    bonding the first member directly to the second member, and measuring the temperature of the device.

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