OLED (Organic Light-Emitting Diode) encapsulation method

OLED (Organic Light-Emitting Diode) encapsulation method

  • CN 106,711,357 A
  • Filed: 01/20/2017
  • Published: 05/24/2017
  • Est. Priority Date: 01/20/2017
  • Status: Active Application
First Claim
Patent Images

1. a kind of OLED encapsulation method, it is characterised in that comprise the following steps:

  • Step 1, one underlay substrate of offer (100), form OLED (200) on the underlay substrate (100);

    Step 2, one cover plate of offer (300), form the electric heating layer (400) of patterning on the cover plate (300);

    The frame portion (410) and at least two that periphery of the electric heating layer (400) including correspondence OLED (200) is set setIn the conducting parts (420) that the frame portion (410) outside is connected with the frame portion (410);

    Step 3, circle glass cement of the coating one (500) in the frame portion (410) of the electric heating layer (400);

    Glass cement (500) described in step 4, high temperature sintering;

    Step 5, the side that cover plate (300) is coated with glass cement (500) and underlay substrate (100) are formed with OLED(200) to group, electric heating layer (400) is powered by conducting parts (420) make it produce heat, heats melten glass glue for side(500) it is made to combine underlay substrate (100) and cover plate (300).

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