A kind of wiring board, compression bonding method and electronic equipment

A kind of wiring board, compression bonding method and electronic equipment

  • CN 106,793,465 A
  • Filed: 12/28/2016
  • Published: 05/31/2017
  • Est. Priority Date: 12/28/2016
  • Status: Active Application
First Claim
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1. a kind of wiring board, it is characterised in that including:

  • The first base material layer;

    The conductive layer of the first base material layer surface is arranged on, the conductive layer has electric conduction routing and is electrically connected with the cablingAt least one golden finger for connecing;

    Second substrate layer of the conductive layer away from the first base material layer side is arranged on, the second substrate layer covering is describedElectric conduction routing;

    It is arranged on color layer of the first base material layer away from conductive layer side;

    Wherein, when the wiring board is crimped with conducting element, by leading between the golden finger and the conducting elementThe gluing knot of electricity, the colour developing layer surface is provided with into chromatograph, when it is described be under pressure into chromatograph meet pre-conditioned when, it is described intoMaterial in chromatograph reacts with the material in the color layer so that the color layer shows pre-set color;

    It is described to exist into chromatographPeeled off with the color layer after the completion of crimping.

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