A kind of high temperature resistant organic solderability preservative and apply usage

A kind of high temperature resistant organic solderability preservative and apply usage

  • CN 106,903,455 A
  • Filed: 12/26/2016
  • Published: 06/30/2017
  • Est. Priority Date: 12/26/2016
  • Status: Active Application
First Claim
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1. a kind of high temperature resistant organic solderability preservative, it is characterised in that:

  • Including the following raw material composition:

    Compositional type imidazole derivative 0.1wt%-10wt%, organic acidic substances 5wt%-35wt%, water-soluble metal salt0.05wt%-1.5wt%, buffer 10wt%-20wt%, deionized water supplies 100%.

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