For polishing the slurry composition for CMP of copper cash and using its polishing method

For polishing the slurry composition for CMP of copper cash and using its polishing method

  • CN 107,109,135 A
  • Filed: 10/12/2015
  • Published: 08/29/2017
  • Est. Priority Date: 04/24/2015
  • Status: Active Application
First Claim
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1. a kind of slurry composition for CMP for being used to polish copper interconnecting line, comprising:

  • Colloidal silica, oxidant, complexing agent, corruptionCorrosion inhibitor, pH adjusting agent and ultra-pure water;

    Wherein, the colloidal silica has 72.9m2/ g to 88.5m2/ g specific surface area (BET) and with 0.1wt% extremely2wt% amount is present.

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