A kind of MEMS and preparation method thereof

A kind of MEMS and preparation method thereof

  • CN 107,140,598 A
  • Filed: 03/24/2017
  • Published: 09/08/2017
  • Est. Priority Date: 03/24/2017
  • Status: Active Grant
First Claim
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1. a kind of preparation method of MEMS, it is characterised in that including:

  • Prepared on micro electro mechanical device chip around the first packaging ring of gas sensitization unit and on the inside of the first packaging ringThe first electric connecting point around gas sensitization unit;

    Position corresponding with the first packaging ring and position corresponding with the first electric connecting point are made respectively on an integrated circuit dieStandby second packaging ring and the second electric connecting point as circuit layer input;

    Micro electro mechanical device chip and IC chip is opposed;

    Wherein, the first electric connecting point, the second electric connecting point are formedElectrically docking, the first packaging ring and the formation sealing docking of the second packaging ring;

    Opened up on micro electro mechanical device chip by micro electro mechanical device chip, IC chip, the first packaging ring and the second encapsulationThe air guide through hole in the space that ring is formed.

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