The preparation method and device of a kind of printed circuit board

The preparation method and device of a kind of printed circuit board

  • CN 107,148,158 A
  • Filed: 06/29/2017
  • Published: 09/08/2017
  • Est. Priority Date: 06/29/2017
  • Status: Active Application
First Claim
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1. a kind of preparation method of printed circuit board, it is characterised in that methods described includes:

  • Nog plate before welding resistance is carried out to the printed circuit board for having completed outer-layer circuit making to handle;

    First time ink coating is carried out to the printed circuit board that nog plate before welding resistance is handled;

    The solder resisting exposure substrate of the printed circuit board is designated designated identification;

    First time ink exposure is carried out to the printed circuit board;

    The printed circuit board that first time ink exposes is post-processed;

    Second of ink coating is carried out to the printed circuit board of post processing;

    Second of ink exposure is carried out to the printed circuit board of second of ink coating;

    Printed circuit board post processing is carried out to the printed circuit board that the second ink exposes.

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