A kind of MEMS and preparation method thereof, electronic installation

A kind of MEMS and preparation method thereof, electronic installation

  • CN 107,226,453 A
  • Filed: 03/24/2016
  • Published: 10/03/2017
  • Est. Priority Date: 03/24/2016
  • Status: Active Application
First Claim
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1. a kind of preparation method of MEMS, it is characterised in that methods described includes:

  • Bottom wafers are provided, engagement ring is formed with the bottom wafers;

    Formed in the both sides of the engagement ring and stop side wall, had between the stop side wall and the engagement ringThere is interval, and the height for stopping side wall is less than the height of the engagement ring;

    Covering wafer is provided, and is combined into one with the bottom wafers;

    Wherein, the layer of bonding material corresponding with the engagement ring is formed with the covering wafer, by instituteState layer of bonding material and stop at the stop side wall with the engagement ring merging that connects, so that the engagement materialThe edge of the bed of material stops that side wall is at least part of contacts overlapping with described.

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