MEMS device, preparation method thereof and electronic device

MEMS device, preparation method thereof and electronic device

  • CN 107,226,453 B
  • Filed: 03/24/2016
  • Issued: 08/13/2021
  • Est. Priority Date: 03/24/2016
  • Status: Active Grant
First Claim
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1. A method of fabricating a MEMS device, the method comprising:

  • providing a bottom wafer, and forming a joint ring on the bottom wafer;

    forming barrier side walls on two sides of the joint ring, wherein a gap is formed between the barrier side walls and the joint ring, and the height of each barrier side wall is smaller than that of the joint ring;

    providing a cover wafer and combining the cover wafer and the bottom wafer into a whole;

    and forming a bonding material layer corresponding to the bonding ring on the cover wafer, and bonding the bonding material layer with the bonding ring and stopping on the barrier side wall so that the edge of the bonding material layer is at least partially overlapped with the contact of the barrier side wall to prevent the bonding material from overflowing.

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