A kind of laser processing and device of dynamic regulation pulse energy and time interval

A kind of laser processing and device of dynamic regulation pulse energy and time interval

  • CN 107,234,336 A
  • Filed: 07/06/2017
  • Published: 10/10/2017
  • Est. Priority Date: 07/06/2017
  • Status: Active Application
First Claim
Patent Images

1. the laser processing device of a kind of dynamic regulation pulse energy and time interval, it is characterised in that including laser, expandCollimating mirror (M1), electronic attenuator runner (Z1), electronic phase delay chip runner (Z2), one or more speculums (M2) and poly-Focus objective lens (M3);

  • The structure of the electronic attenuator runner (Z1) is identical with the structure of electronic phase delay chip runner (Z2), and both of which is carriedRecirculated water cooling mechanism and gas curtain air cooling mechanism, while be also connected with an electronic rotation mechanism, the electronic rotation mechanism programmingIt is controllable, for driving electronic attenuator runner (Z1) and electronic phase delay chip runner (Z2) to be revolved around its center axis respectivelyTurn;

    The electronic attenuator runner (Z1) and electronic phase delay chip runner (Z2) both of which are in disk form, in the edge of diskSide is along the circumferential direction evenly arranged with multiple size identical circular mounting holes (11), the center of circle position of multiple circular mounting holes (11)In on same circumference;

    The central axis of multiple circular mounting holes (11) and electronic attenuator runner (Z1) and electronic phase delayThe centerline axis parallel of piece runner (Z2);

    Multiple laser attenuation pieces are separately installed with multiple circular mounting holes (11) of the electronic attenuator runner (Z1), it is multipleThe installation position of laser attenuation piece causes the central axis of the multiple laser attenuation piece, and electronic attenuator runner (Z1)Central axis is mutually parallel;

    The pad value of the multiple laser attenuation piece is different;

    The multiple laser attenuation piece is in the erection sequence of multiple circular mounting holes (11):

    By multiple laser attenuation pieces by decayIt is worth size sequence, i.e., is sequentially arranged at multiple circles according to the order of pad value from big to small or from small to large in a clockwise directionOn mounting hole (11);

    Multiple phase delay chips are separately installed with multiple circular mounting holes (11) of the electronic phase delay chip runner (Z2),The installation position of multiple phase delay chips causes the central axis of the multiple phase delay chip, and electronic phase delay chip to turnThe central axis for taking turns (Z2) is mutually parallel;

    The phase-delay value of the multiple phase delay chip is different;

    Erection sequence of the multiple phase delay chip in multiple circular mounting holes (11) be:

    Multiple phase delay chips are pressed into phaseLength of delay size sorts, i.e., be sequentially arranged in a clockwise direction according to the order of phase-delay value from big to small or from small to largeOn multiple circular mounting holes (11);

    The processing laser beam that laser is sent is incident to beam-expanding collimation mirror (M1), after beam-expanding collimation mirror (M1) beam-expanding collimation,An attenuator on vertical incidence to electronic attenuator runner (Z1), after the decay of attenuator, vertical incidence to electronic phaseA phase delay chip on position delay piece runner (Z2), after the delay of phase delay chip, reflected mirror (M2) reflection is laggardEnter focusing objective len (M3), workpiece surface is focused on after focusing objective len (M3) output.

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