MEMS wafer class encapsulation structure and its technique

MEMS wafer class encapsulation structure and its technique

  • CN 107,265,391 A
  • Filed: 06/29/2017
  • Published: 10/20/2017
  • Est. Priority Date: 06/29/2017
  • Status: Active Application
First Claim
Patent Images

1. a kind of MEMS package structure, including:

  • First substrate, one or more MEMSs and one or more gold are formed with the first surface of first substrateBelong to pad;

    Be connected and extend to the through hole of the second surface of first substrate with the metal pad, the second surface with it is describedFirst surface is relative;

    It is arranged on the sandwich construction on the through-hole side wall and the second surface;

    It is arranged on the rewiring layer on the sandwich construction and the metal pad;

    It is arranged on the soldered ball on the rewiring layer;

    AndThe block formed above the device of first substrate, so as to form envelope between the block and first substrateIt behave affectedly body, wherein having one or more perforates in the block so that the encapsulation cavity is connected with the external world.

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