A kind of interim bonding method of wafer

A kind of interim bonding method of wafer

  • CN 107,331,644 A
  • Filed: 04/29/2016
  • Published: 11/07/2017
  • Est. Priority Date: 04/29/2016
  • Status: Active Application
First Claim
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1. a kind of interim bonding method of wafer, it is characterised in that comprise the following steps:

  • Step 1, one slide glass of offer, multiple vacuum tanks are opened up on the first face of the slide glass;

    Step 2, one wafer of offer, under vacuum conditions by the bonding face of the wafer and the slide glassFirst face is fitted, and is bonded at the edge of the bonding face with the first face of the slide glass by being bonded glueForm bonding pad;

    Step 3, the back process for carrying out the wafer;

    Step 4, the wafer dissociated from the slide glass.

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