Printed circuit board (PCB) is to the junction surface of mold compound

Printed circuit board (PCB) is to the junction surface of mold compound

  • CN 107,548,573 A
  • Filed: 07/31/2015
  • Published: 01/05/2018
  • Est. Priority Date: 07/31/2015
  • Status: Active Application
First Claim
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1. a kind of device, described device include:

  • Printed circuit board (PCB), the printed circuit board (PCB) have the first thermal coefficient of expansion;

    The compound being molded in around the printed circuit board (PCB), the compound have different from first thermal coefficient of expansionSecond thermal coefficient of expansion;

    AndJunction surface between the edge of the printed circuit board (PCB) and the compound, the junction surface have the 3rd thermal expansion systemNumber, the 3rd thermal coefficient of expansion is between first thermal coefficient of expansion and second thermal coefficient of expansion.

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