A kind of heat sink insulated type capsulation structure for semiconductor laser and folded battle array

A kind of heat sink insulated type capsulation structure for semiconductor laser and folded battle array

  • CN 107,565,376 A
  • Filed: 10/13/2017
  • Published: 01/09/2018
  • Est. Priority Date: 10/13/2017
  • Status: Active Application
First Claim
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1. a kind of heat sink insulated type capsulation structure for semiconductor laser, it is characterised in that including at least one semiconductor laserUnit, each semiconductor laser element include:

  • First semiconductor laser module, the second semiconductor laser module, connectionElectrode, refrigerator;

    Wherein,First semiconductor laser module and the second semiconductor laser module include:

    Laser chip, conductive layer, the laserFor chip bonding on the conductive layer, the conductive layer is arranged at the surface of the refrigerator, insulated from each other with the refrigerator;

    The electrode position of the electrode position of first semiconductor laser module and the second semiconductor laser module is on the contrary, pass through companyReceiving electrode realizes the electrical connection between the first semiconductor laser module and the second semiconductor laser module.

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