A kind of sandwich silicon composition and its forming method and purposes

A kind of sandwich silicon composition and its forming method and purposes

CN
  • CN 107,599,516 A
  • Filed: 08/03/2017
  • Published: 01/19/2018
  • Est. Priority Date: 08/03/2017
  • Status: Active Application
First Claim
Patent Images

1. A kind of 1. sandwich silicon composition, it is characterised in that:

  • The composition is between one pack system, moisture-curable slice-like layers1. composite, upper and lower surface are covered by release liners, gross thickness is 1.5~2mm, wherein 3. enhancing screen cloth combines in organosiliconThe centre of thing matrix 2., in sandwich structure.

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