High-color-gamut blue-green LED backlight module and manufacturing method thereof

High-color-gamut blue-green LED backlight module and manufacturing method thereof

  • CN 107,816,665 B
  • Filed: 11/02/2017
  • Issued: 01/07/2020
  • Est. Priority Date: 11/02/2017
  • Status: Active Grant
First Claim
Patent Images

1. The utility model provides a blue and green LED backlight unit, includes blue red LED lamp pearl (11), green glow LED lamp pearl (12), PCB board (2), metal backboard (3), reflection paper (4), lower light guide plate (5), goes up light guide plate (6), diaphragm (7), OPEN CELL (8), its characterized in that:

  • the PCB (2) is a rectangular strip-shaped circuit board, and two rows of LED lamp beads are welded on the PCB;

    the blue-red LED lamp beads (11) and the green LED lamp beads (12) are respectively positioned in an upper row and a lower row;

    one side of the PCB (2) is provided with four strip-shaped PCB welding spots (21) vertical to the short edge;

    the back of the PCB (2) is attached to the inner side of the short side of an L-shaped metal back plate (3), reflective paper (4) is placed on the inner layer of the long side of the metal back plate (3), and a lower light guide plate (5), an upper light guide plate (6), a diaphragm (7) and an OPEN CELL (8) are sequentially placed above the reflective paper (4);

    the LED lamp bead comprises a support (101), an LED chip (102), a gold wire (103), packaging glue (104), a white strip (105), a small bonding pad (106) and a large bonding pad (107);

    wherein the bracket (101) is a rectangular groove with an inclined inner side wall;

    a section of white strip (105) is embedded in the middle of the bottom of the support (101), and small bonding pads (106) and large bonding pads (107) penetrating through the bottom of the support are respectively arranged on two sides of the white strip (105);

    the small bonding pad (106) and the large bonding pad (107) respectively extend out of two sides of the bottom of the bracket (101);

    an LED chip (102) is fixed on the inner side of the bottom of the support (101), a P electrode and an N electrode are arranged on the left and right of the top of the LED chip (102), and the P electrode and the N electrode are respectively connected to a small bonding pad (106) and a large bonding pad (107) on the bottom through gold wires (103);

    packaging glue (104) is filled in the groove of the bracket (101);

    an upper row and a lower row of series circuits are arranged in the PCB (2), a blue-red LED lamp bead (11) series circuit is arranged on the upper row, two ends of the blue-red LED lamp bead (11) series circuit are connected to two PCB welding spots (21), a green LED lamp bead (12) series circuit is arranged on the lower row, and two ends of the green LED lamp bead (12) series circuit are connected to the other two PCB welding spots (21);

    the PCB welding spots (21) of the two rows of series circuits are respectively connected with two control power supplies by leads;

    an upper condensing lens (13) and a lower condensing lens (14) which correspond to the blue-red LED lamp beads (11) and the green-light LED lamp beads (12) are respectively arranged on the left sides of the lower light guide plate (5) and the upper light guide plate (6), and an upper condensing lens reflecting layer (131) and a lower condensing lens reflecting layer (141) are respectively arranged on the upper surface and the lower surface of the upper condensing lens (13) and the lower condensing lens (14);

    in the blue-red LED lamp bead, the excitation wavelength of a blue chip is 440nm-470nm, the excitation wavelength of red fluorescent powder is 620nm-650nm, in the green LED lamp bead, the wavelength of a green chip is 500nm-545nm, and the red fluorescent powder is made of one or more of nitride fluorescent powder, fluoride fluorescent powder, KSF fluorescent powder or silicate fluorescent powder;

    the material in the bracket (101) is composed of one or more of ceramics, PCT, EMC and SMC, and the size specification of the bracket (101) is one of 4010, 4014, 7020 and 7016;

    one or more LED chips (102) are arranged in the blue-red LED lamp beads (11) and the green LED lamp beads (12);

    the PCB (2) independently controls the luminous intensity of the blue-red LED lamp beads (11) and the green LED lamp beads (12) through two control power supplies;

    the blue-red LED lamp beads (11) emit red blue light, the red blue light enters the upper light guide plate (6), the green light LED lamp beads (12) emit green light, and the green light enters the lower light guide plate (5);

    green light in the lower light guide plate (5) is refracted on the upper end face of the reflection paper surface, penetrates out of the upper surface of the lower light guide plate (5) and enters the upper light guide plate (6);

    the red and blue light in the upper light guide plate (6) and the green light entering from the lower light guide plate (5) are mixed and then penetrate out of the upper light guide plate (6);

    the mixed light is mixed again through a membrane (7), and finally the mixed light is irradiated on OPENCELL (8);

    the blue-green LED backlight module is manufactured by the following steps;

    step one, preparing an LED lamp bead;

    the blue light chip is fixedly crystallized at the bottom of the support (101), the blue light chip is respectively connected with the P electrode, the N electrode, the small bonding pad (106) and the large bonding pad (107) through gold wires (103), packaging glue (104) mixed with red fluorescent powder is added into a groove of the support (101), and the packaging glue (104) is baked and cured to form a blue-red LED lamp bead (11);

    the green chip is fixedly crystallized at the bottom of the support (101), the green chip is respectively connected with the P electrode, the N electrode, the small bonding pad (106) and the large bonding pad (107) through gold wires (103), packaging glue (104) is added into the groove of the support (101), and the packaging glue (104) is baked and cured to form a green LED lamp bead (12);

    step two, preparing a double-circuit board;

    the blue-red LED lamp beads (11) and the green LED lamp beads (12) are fixedly welded on the PCB (2) in an upper row and a lower row respectively through solder paste on the PCB (2);

    four wires are arranged on the four PCB welding spots (21) and are connected with two control power supplies;

    step three, assembling the backlight module;

    the back of the PCB (2) is pasted on the inner side of the L-shaped short plate of the metal back plate (3) through back glue, and the lower light guide plate (5), the upper light guide plate (6), the diaphragm (7) and the OPEN CELL (8) are sequentially placed on the L-shaped long plate of the metal back plate (3).

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×