OLED encapsulation method and OLED encapsulating structures

OLED encapsulation method and OLED encapsulating structures

  • CN 107,946,480 A
  • Filed: 11/01/2017
  • Published: 04/20/2018
  • Est. Priority Date: 11/01/2017
  • Status: Active Application
First Claim
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1. a kind of OLED encapsulation method, it is characterised in that include the following steps:

  • TFT substrate (10) step S1, is provided, OLED device (30) is made in the TFT substrate (10);

    In the OLED device(30) outer surface forms the first passivation layer (41) for coating the OLED device (30);

    Step S2, the ultraviolet light absorbing layer for coating first passivation layer (41) is formed in the first passivation layer (41) outer surface(50), the ultraviolet light absorbing layer (50) includes organic resin and is scattered in organic resin and with UV absorbanceInorganic particle, the ultraviolet light absorbing layer (50) are transparent;

    Step S3, encapsulation cover plate (20) is provided, the outer peripheral areas that OLED device (30) is corresponded on the encapsulation cover plate (20) appliesCloth frame glue (60), and encapsulating material (70) is set in the region surrounded on the encapsulation cover plate (20) by frame glue (60);

    Step S4, encapsulation cover plate (20) and TFT substrate (10) are attached into TFT substrate (10) respectively to bit combination, frame glue (60)With surrounding sealing space (61), the package material on encapsulation cover plate (20) and between TFT substrate (10) and encapsulation cover plate (20)Material (70) is filled in the sealing space (61).

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