Sensor structure, system and method with improved integrated and optimization encapsulation

Sensor structure, system and method with improved integrated and optimization encapsulation

  • CN 108,168,765 A
  • Filed: 01/26/2015
  • Published: 06/15/2018
  • Est. Priority Date: 01/24/2014
  • Status: Active Application
First Claim
Patent Images

1. a kind of sensor component, including:

  • Substrate;

    Multiple and different, individual, discontiguous support component, is separated from each other and arranges on the substrate, described moreEach support component in a support component is into cylinder;

    AndDisplaceable element, by the plurality of different, individual, discontiguous support component support on the substrate and withThe dice spaced is opened, wherein the displaceable element, the substrate and the plurality of different, individual, discontiguousSupport component limit cavity, the displaceable element can be deflected in response to the physical quantity sensed by the sensor component intoEnter the cavity.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×