A kind of circuit board machining process forming circuit and figure using laser ablation

A kind of circuit board machining process forming circuit and figure using laser ablation

  • CN 108,282,964 A
  • Filed: 01/31/2018
  • Published: 07/13/2018
  • Est. Priority Date: 01/31/2018
  • Status: Active Application
First Claim
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1. a kind of circuit board machining process forming circuit and figure using laser ablation, it is characterised in that:

  • Include the following steps,S1:

    Prepare for the board substrate of laser processing processing, and cleaning working process is carried out to the board substrate surface;

    S2:

    Using laser-induced thermal etching, ready board substrate surface is etched groove body processing in step sl, forms conductorLine pattern;

    And the conductor line figure center line distance wide scope of control laser ablation, between 1um-100um, etching depth isBetween 0.2um-500um;

    S3:

    Raceway groove cleaning is carried out to the board substrate after the completion of laser-induced thermal etching working process in step S2, and cleaning process is adoptedLaser residue cleaning is carried out with plasma gas and ultrasonic wave;

    S4:

    High-temperature laminating;

    It cleans in step s3 and attaches protective layer above the board substrate of completion, and fast press and pressure transmission machineEquipment carries out high-temperature laminating;

    Control pressing-in temp range between 80 DEG C -400 DEG C, pressing time range 30 minutes -300 pointsBetween clock;

    S5:

    Working process finishes.

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