Camera module based on infrared absorption structure and its application

Camera module based on infrared absorption structure and its application

  • CN 108,696,672 A
  • Filed: 04/07/2017
  • Published: 10/23/2018
  • Est. Priority Date: 04/07/2017
  • Status: Active Application
First Claim
Patent Images

1. a camera module, which is characterized in that including:

  • An at least circuit board module, at least a camera lens, and at least one photosensitive corePiece, wherein the sensitive chip is electrically connected to the circuit board module, the camera lens is located at the photosensitive path of the sensitive chip,The wherein described sensitive chip includes an at least chip body and at least one absorption filter layer, wherein the absorption filter layer positionIn the photosurface of the chip body, to filter for the camera module.

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