The system and method examined and measured for semiconductor wafer

The system and method examined and measured for semiconductor wafer

  • CN 108,780,764 A
  • Filed: 01/13/2016
  • Published: 11/09/2018
  • Est. Priority Date: 01/12/2015
  • Status: Active Application
First Claim
Patent Images

1. a kind of system comprising:

  • Platform is configured to holding wafers;

    Light source is configured to light beam being guided at the surface of the chip on the platform;

    Sensor is configured to receive the light beam for being reflected off the surface, and provides at least two channel of polarization,Each of described channel of polarization provides signal;

    AndController is communicated with the sensor electronic, wherein the controller is configured to:

    Receive the signal from each of the channel of polarization;

    Difference between regular a pair of signal, to generate regular result;

    AndThe value of the layer on the chip, wherein institute are determined based on the regular result and the overall strength to the signalIt is one of thickness, surface roughness, material concentration or critical dimension to state value.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×