Semiconductor devices including embedded controller naked core and its manufacturing method

Semiconductor devices including embedded controller naked core and its manufacturing method

  • CN 108,807,348 A
  • Filed: 01/28/2013
  • Published: 11/13/2018
  • Est. Priority Date: 01/28/2013
  • Status: Active Application
First Claim
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1. a kind of semiconductor devices, including:

  • Substrate, including dielectric layer and conductive layer on the dielectric layer, the conductive layer includes conductive pattern, the conductive patternCase includes electric trace and engagement pad;

    The cavity formed in the substrate, down to the dielectric layer;

    The first semiconductor bare chip installed in the cavity, is electrically isolated on the dielectric layer, and first semiconductor is nakedCore includes naked core bond pad;

    The electric trace formed between the engagement pad and the naked core bond pad of first semiconductor bare chip of the substrate, by instituteIt states the first semiconductor bare chip and is electrically connected to the substrate;

    AndThe second semiconductor bare chip installed on the substrate, it includes that first semiconductor is naked at least to cover in the cavityA part for core.

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