Etching method and etching line for inner layer precise circuit of printed circuit board

Etching method and etching line for inner layer precise circuit of printed circuit board

  • CN 109,905,972 B
  • Filed: 12/11/2017
  • Issued: 08/27/2021
  • Est. Priority Date: 12/11/2017
  • Status: Active Grant
First Claim
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1. A method for etching inner precise lines of a printed circuit board is characterized by comprising the following steps:

  • selecting a nozzle combination of an etching line according to the thickness of the copper layer of the circuit board;

    acquiring optimal compensation values of line widths of different areas of the line pattern under the nozzle combination;

    compensating the line width of the corresponding area of the line graph according to the optimal compensation value;

    manufacturing a mask on the surface of the copper layer of the circuit board according to the compensated line pattern;

    etching the copper layer of the circuit board by adopting the selected nozzle combination on the etching line;

    the nozzle combination for selecting the etching line according to the thickness of the copper layer of the circuit board specifically comprises the following steps;

    if the thickness of the copper layer is greater than or equal to 2OZ, a fan-shaped nozzle is adopted at the front 2/3 section of the etching line, and a cone-shaped nozzle is adopted at the rear 1/3 section of the etching line;

    if the thickness of the copper layer is more than HOZ and less than 2OZ, a fan-shaped nozzle is adopted in the front 1/3 section of the etching line, and a cone-shaped nozzle is adopted in the rear 2/3 section;

    if the thickness of the copper layer is smaller than or equal to HOZ, the front 1/3 section of the etching line adopts a fan-shaped nozzle and a conical nozzle which are alternately arranged along the direction of the etching line, and the rear 2/3 section adopts a conical nozzle;

    the acquiring of the optimal compensation values of the line widths of the different areas of the line pattern under the nozzle combination specifically includes;

    obtaining the optimal compensation values of the line widths of different areas of the line pattern under the nozzle combination according to the thickness of the copper layer and the characteristics of the line pattern;

    the obtaining of the optimal compensation value of the line width of the different areas of the line pattern under the nozzle combination according to the thickness of the copper layer and the characteristics of the line pattern specifically includes;

    determining a basic compensation value according to the thickness of the copper layer;

    acquiring the characteristics of the line pattern, wherein the characteristics comprise density area distribution, line trend and positions of a bonding pad and/or a hole ring, and determining additional compensation values of different areas according to the characteristics of the line pattern;

    compensating the line width of the corresponding area of the line graph according to the basic compensation value and the additional compensation values of different areas;

    carrying out etching test under the nozzle combination, and adjusting according to the test result so as to obtain the optimal compensation value of the line width of different areas of the line pattern under the nozzle combination;

    acquiring the distance between any line and the adjacent line according to the density area distribution, and if the distance between any line and the adjacent line in the circuit board with the copper layer thickness of HOZ is more than or equal to 20mil, compensating the line width of the line by 0.1 mil;

    if the distance between any line and the adjacent line in the circuit board with the copper layer thickness of 1OZ is more than or equal to 20mil, the line width of the line is compensated by 0.2 mil.

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