Production of rigid polyurethane foams having reduced thermal conductivity, and use thereof

Production of rigid polyurethane foams having reduced thermal conductivity, and use thereof

  • CN 1,132,138 A
  • Filed: 10/21/1995
  • Published: 10/02/1996
  • Est. Priority Date: 10/22/1994
  • Status: Abandoned Application
First Claim
Patent Images

1. one kind prepares the method with the rigid PIC foam of low heat conductivity, be at d) blowing agent, c) catalyst and, f if desired) under the existence of additive, by reaction a) organic PIC and b of organic and/or modification) compound that contains at least two active hydrogen atoms of at least a relative HMW, c if desired) low-molecular-weight cahin extension agent and/or crosslinking agent, and carry out, wherein rigid polyurethane foams contains the aromatic group of at least 32% weight percentage, these groups add formation component (a), (b) and/or, if usefulness, (c) in.

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