Process for surface mounting flip chip carrier modules

Process for surface mounting flip chip carrier modules

  • CN 1,137,505 C
  • Filed: 12/30/1994
  • Issued: 02/04/2004
  • Est. Priority Date: 01/07/1994
  • Status: Active Grant
First Claim
Patent Images

1. the method that making, processing and storage surface are installed flip chip carrier comprises the following steps:

  • Make an organic chip carrier substrate;

    The array that connects with reflux solder is directly connected to flip-chip on the chip carrier substrate, make chip near connecting and substrate from a distance;

    With organic encapsulants the distance between flip-chip and the carrier substrates is sealed, is connected with the protection scolder,It is characterized in that also comprising the following steps;

    that by reducing moisture subsequently solder attachment is unlikely to form solder bridging between each connects so that make from the moisture of air in encapsulation agent between flip-chip and the carrier substrates is controlled in the diffusion of encapsulation agent,Wherein, the step of the moisture in the control encapsulation agent one of comprises the following steps at least;

    Described chip carrier is stored in improved in the temperature more than 40 ℃

    ;

    Described chip carrier is stored in the airtight environment, andDescribed chip carrier is cured.

View all claims
    ×
    ×

    Thank you for your feedback

    ×
    ×