Fabrication of thermoelectric modules and solder for such fabrication

Fabrication of thermoelectric modules and solder for such fabrication

  • CN 1,211,342 A
  • Filed: 09/30/1996
  • Published: 03/17/1999
  • Est. Priority Date: 10/03/1995
  • Status: Abandoned Application
First Claim
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1. thermoelectric components, it comprises:

  • A. n type and the p type array of thermoelectric elements of making by semi-conducting material;

    B. be deposited on the shallow layer that is made of electric conducting material of element two ends, described material comprises the bismuth of about 50-100% weight ratio, and all the other mainly are antimony;

    C. the busbar that has the phosphorus nickel surface, the phosphorus content on wherein said surface is at least 3.5%;

    D. the thermoelectric element of above-mentioned coating is connected to the scolder of the above-mentioned phosphorus nickel on the above-mentioned busbar, this scolder contains the bismuth of 50-99% weight ratio and the antimony of 50-1% weight ratio.

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