Manufacturing method of electroplated nickel/gold chip package base plate electric contact pad and its structure
Manufacturing method of electroplated nickel/gold chip package base plate electric contact pad and its structure
- CN 1,216,422 C
- Filed: 12/20/2001
- Issued: 08/24/2005
- Est. Priority Date: 12/20/2001
- Status: Expired
- EN CH
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- Pin
