Manufacturing method of electroplated nickel/gold chip package base plate electric contact pad and its structure

Manufacturing method of electroplated nickel/gold chip package base plate electric contact pad and its structure

  • CN 1,216,422 C
  • Filed: 12/20/2001
  • Issued: 08/24/2005
  • Est. Priority Date: 12/20/2001
  • Status: Active Grant
First Claim
Patent Images

1. the structure of a chip package base plate electric contact mat comprises a substrate, and this substrate has the line layer of circuit patternization, and this line layer has some electric contact mats, it is characterized in that:

  • Each outer surface of the electric contact mat of this substrate is all fully by an electronickelling/the gold layer coats, and this substrate is not laid in the electroplated lead of electric contact mat as electronickelling/golden usefulness in addition.

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