Metal backed printed circuit board assemblies

Metal backed printed circuit board assemblies

  • CN 1,233,763 C
  • Filed: 06/08/1998
  • Issued: 12/28/2005
  • Est. Priority Date: 07/09/1997
  • Status: Active Grant
First Claim
Patent Images

1. , a kind of printed circuit-board assembly comprises:

  • A) printed circuit board (PCB), it comprises a dielectric substrate, second metal level on the first metal layer on apparent surface who is placed in described substrate and another apparent surface who is placed in described substrate;

    B) metal backing, it has one and connects the surface;

    WithC) bonding coat is used for second metal level of described printed circuit board (PCB) is adhered to the connection surface of described metal backing;

    Described bonding coat comprises binder polymer and at least a its electromotive force less than 1 volt conducting metal, described conducting metal by disperse in whole described polymkeric substance.

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