Etchant and substrate with etched copper wire array

Etchant and substrate with etched copper wire array

  • CN 1,257,313 C
  • Filed: 12/19/2001
  • Issued: 05/24/2006
  • Est. Priority Date: 12/20/2000
  • Status: Active Grant
First Claim
Patent Images

1. etching reagent comprises:

  • Hydrogen peroxide;

    Stabilizer of hydrogen peroxide;

    WithThe mixing solutions that comprises at least a material in organic acid, mineral acid and the neutral salt.

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