Reinforced electroplating process with masked cathode

Reinforced electroplating process with masked cathode

  • CN 1,273,647 C
  • Filed: 05/20/2003
  • Issued: 09/06/2006
  • Est. Priority Date: 05/20/2003
  • Status: Active Grant
First Claim
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1. reinforcement electro-plating method that negative electrode covers, it is characterized in that:

  • its step that comprises has;

    Plating piece is carried out the electroless plating program, make plating piece surface attachment layer of metal film;

    Install the shielding cell program, this shielding cell shape and structure of impermeable structure and the circumference shape on plating piece surface are coincide mutually, settle plating piece on cathode carrier behind the installing shielding cell, and this cathode carrier is provided with cathode block, to be connected to plating piece;

    Carry out galvanizing process, this shielding cell of impermeable structure, make the electroplate liquid ion can'"'"'t directly be attached to the plating piece circumference, and enter by the space between shielding cell and plating piece, the plating distance of plating piece circumference that promptly adds shielding cell so that the concentration of electroplate liquid ion plating on the circumference of plating piece reduces, is plated on the thickness attenuation of circumference than the middle table face length, and the electroplating time that can extend increases the coating film thickness of plating piece intermediate surface, thereby reaches the effect of ease of assembly and reinforcement.

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